Israel Science and Technology Homepage

Verification IP and services for the semiconductor industry. Specialist in coverage driven random verification of HDL designs.

ASIC and VLSI design including FPGA conversions, Gate Array and Cell Based designs. Customizable DSP core (CDSP) implemented in DSLAM products of xDSL chip set. DES Encryption/Decription core. Electronic Design Automation (EDA) and STD products support.

Electronic design for embedded systems, computer programming, linear and discrete servo control, process automation. Reverse engineering. Repairs of PC Boards at electronic component level. Circuit analyses for fault sources. EPROM, OTP, Flash Devices.

Surface-finishing for PWB (Printed Wire Board) and electronics industries. Member of Enthone group. Technologies include Pattern-Panel and Through-Hole Plating, Hot Air Solder Leveling, Dry Film Imaging, Surface Treatment, Tin Immersion, Shielding.

Development of high end digital signal processors.

DSP cores and IP platforms. Communication: Bluetooth, 802.11, 2.5G, 3G and Multi-Gig serial comms. Electronic platforms - GPS, digital audio, Smartphone, PDA, and VOIP. PLLXpert: Design and deployment service for PLL and Clock Synthesis IP Cores.

Noncontact Temperature Monitor (NTM), Electro-optical temperature monitor based on the measurement of optical characteristics of semiconductor wafers. WetSpec100 non-contact monitor of chemical composition of liquids such as peroxide in slurry, HF, HCl.

Electronic design automation (EDA) technologies and engineering services that speed IC and system design for semiconductors, printed circuit boards and systems used in consumer electronics, networking and telecommunications equipment and computer systems.

Fabless semiconductors for connecting devices to IP-based networks. iChip updateable Internet Controller chips for embedding IP-based communication in low-cost non-PC devices running M2M (machine-to-machine) applications. Wireless internet adapters.

40Gbps Indium Phosphide Electro-Absorption Modulators for Dense Wavelength Division Multiplexing (DWDM) systems to increase bandwidth over fiber optic backbones by transmitting several wavelengths of light simultaneously over the same optical fiber.

Computerized electronic design and Computer Aided Design (CAD) services. PCB layout and schematic design. Gerber processing (CAM Support) including verifying gerber files for manufacturing (DFM).

SmartCores programmable Digital Signal Processor (DSP) cores used in semiconductor chips for diverse applications: digital cellular phones, digital cameras, MP3 players, multimedia devices, modems, VoIP, telephony and hard disk drive controllers.

Design of IF and RF receiving products for EW and radar systems. Detector Logarithmic Video Amplifiers (DLVAs). FM Discriminators. IF Limiters. S-RAM and Flash Memory modules. Analog/digital Multi Chip Modules (MCMs). Alphanumeric LED display modules.

Microwave facility can integrate almost any custom RF chain to a single component. Synthesizers and frequency sources. Passive components: Filters, Couplers, Multiplexers. Low Noise Amplifiers. Transmitters. Receivers. Static RAM and Flash EEPROM devices.

XPlan - Engineering tool for CAM automation. Genesis 2000 - provides optimized CAM via full pre-production automation for PCB fabricators.

PROC boards: Generic FPGA/PLD based boards for system prototyping and ASIC emulation. Mezzanine boards with LVDS communication and fast prototyping capability. SW for Automatic generation of hardware/software interface for user design in a PC environment.

MMIC solutions that enable next generation wireless microwave systems up to 90GHz and drivers, TIAs and TFPS optical modulators for 40G and 100G fiber-optic telecommunications and data-communications networks.

Krypton DSP processing engine for GigE-Vision cameras. GigE-Connect SA-CLB, camera link base to gigabit ethernet stand alone converter. Composite, YC, RGB to Gigabit Ethernet stand alone converter. GigE traffic accelerator for Windows.

Intel Pentium microprocessor development and production. Networking, wireless telecommunications and Internet telephony solutions.

Turnkey electronic product design, Systems-on-a-Chip (SoC), ASIC or FPGA. Large (500k-1 million gates) multi-chip systems. Embedded SRAM/DRAM integration. Wireless networking and digital media products. Fuzzy logic and neural networks.

X-Ray based semiconductor metrology for metal and dielectric thin films. Metrology tools designed specifically for high-volume FABs, and front-end as well as back-end applications.

Design services including FPGA, structured ASIC, ASICs and circuit and analog design. Open-source IP-Cores.

DSP systems for the communications, medical imaging, array, image and voice/audio processing markets for PCI, EVM, cPCI, VME platforms in different form factors. MATLAB based development environment for real-time DSP applications.

Broadband communications technologies and storage products. System-On-Chip (SOC) solutions.

Fabless semi-conductor company that specializes in developing system-on-a-chip solutions for wideband and broadband communications systems.

Design and development of a variety of VLSI microprocessors, digital signal processors, data communication, micro-controllers, PowerPC processors, automotive electronics, cellular communication.

Manufacture of quartz crystal resonators for OCXO (Oven Controlled Crystal Oscillator) for Piezo electric applications . Standard Crystal Frequency range from 4.096 MHz to 120 MHz.

Single-chip ICs for communications with proprietary Reclocking Technologies. ICs for ATM 25Mb/s Networks and Token Ring local area networks, for the IBM AS/400 systems, multiplexers, stars and repeaters supporting IBM 5250 standards.

Electronic board design service. Electronic prototype manufacturing. Pcb printed circuit board design. Completed projects include power supply tester, headphone amplifier, PC camera control module, VGT controller, laser driver.

Intellectual Property, semiconductors and acceleration boards for massively-parallel processing. Flagship HyperCore processor: general-purpose accelerator for multicore/manycore SoCs. Task-oriented programming model simplifies parallel code compilation.

Development of SMT Surface Mount solutions for the electronics industry. Lines for high-speed surface mount and fine pitch assembly from 0402 chips to 15 mil-pitch packages. ICT board testing 24 hours per day.

Chip development, ASIC/FPGA design and verification using Specman eRM, System Verilog OVM/VMM, Verilog/Vhdl. Experience in protocols: SONET-SDH, WUSB, UWB, GPON, ATM, HDLC, Ethernet, PCI, PCIExprss2, AHB, USB, SPI4, ARM, SD, SDIO, SMIA.

iPDA series PCI boards for high performance data acquisition systems (up to 2GHz sampling rate). Medical image and data storage systems, biofeedback and diagnostic ultrasound systems. General purpose PC cards including ADC, DAC, I/O and communication.

Manufacturer of ultra-high density full-custom ASiXs for the deep-submicron age using metal Poly CMOS processes. Customizable embedded memory blocks, embedded SRAMs, ROMs, FlexCAMs (Content Addressable Memories). A/D and D/A converters.

DeskPOD hardware modeler to verify electronic products constructed from programmable logic, application specific integrated circuits (ASICs), and off-the-shelf semiconductor devices.

Digital, mixed signal and analog ASIC design. Turn key projects for OEMs. FPGA conversion. RTL to gate level synthesis and ATPG. VHDL design. Verilog design. Core design. 90% of projects for international companies.

Integrated configurable system on chip (CSoC) devices for Digital Control of Electronic Power Devices. IDC architecture for building lighting applications, dimmable fluorescent electronic ballast design, automotive motors and actuators.

Fabless semiconductor hybrid battery module allows OEMs to put both a rechargeable battery and a disposable battery in one easy-to-use package making the ideal power pack with both high energy (primary battery) and high power (rechargeable battery).

Wafer level chip size packaging for semiconductor devices. ShellOP CSP solution for image sensors and light detection applications. ShellBGA Chip Size packaging for memory, logic, RF, analog, Integrated Passive Components ("IPCs").

Foundry manufacturer of semiconductor integrated circuits (ICs) on silicon wafers. Embedded non-volatile memory devices, CMOS image sensors, and mixed signal devices. Integration of large Flash arrays in embedded applications.

Designer of Programmable Logic Controllers (PLCs), the computer 'brains' that automate mass production lines. OPLC combinea Operating Panels with display, keyboard and Programmable Logic Controllers in a single unified device.

ASIC design and verification. Standard based applications ATM / ETH / SDH-SONET / PCI / USB, CPUS (Palm / CARMEL / X86) and systems (routers, cellular phones, fax machines etc.). Fluent in Verilog/VHDL/C++/Perl/Clearcase/RCS, using PLI/FLI based tools.

IC and EDS design house providing ASIC and Field-programmable gate array (FPGA) design services, and Electronic Design complex System engineering services. IPs in many domains including: HDMI, PCI Express, SDIO, AXI, AHB, SPI4, I2C, SMBUS, PMBUS, GPON.

Manufacturer of discrete semiconductors (diodes, rectifiers, transistors, opto-electronics, and selected integrated circuits) and passive electronic components (resistors, capacitors, inductors, and transducers).

Chip-scale optical interconnect solution for Grid computing and data center applications. XFlame technology enables wafer level mass production of opto-electric components using standard semiconductor processes, enables a 1:10 reduction of size and cost.

Development and manufacturing of VLSI and embedded SW for video and audio compression. Supplier of ICs for DVD players, digital still cameras, digital speakers, etc.